Details

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Features
Large-diameter solder removal nozzle and high efficiency solder removal design.
Customized multiple specifications of solder removal nozzles.
Fully simulating the SMT reflow soldering heating temperature at the top and bottom and programmable in adjustment.
Precise motion of multi-axis robot motion platform and the moving position programmable.
QUICK cycle heating temperature control system, real-time monitoring of heating temperature, safe and efficient.
Applicable to: BGA solder removal and P C B solder pad removal.


With the intensive BGA application design and the pursuit of higher BGA rework yield in recent years, the traditional manual solder removal cannot meet the process requirements; QUICK EA-F16 automatic solder removal equipment meets the requirements for personnel, reduces the using amount of solder sucking lines and solder wires and minimizes the occupational hazards caused by manual solder removal in the BGA solder removal process; with specially designed non-contact nozzle and strong suction, it has become a type of innovative product featuring soldering pad cleaning, oxidation avoidance, no soldering pad damage, solder residues collection and safe operation.